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@inproceedings{helsper:linac2022-tupopa25, author = {J. Helsper and S.K. Chandrasekaran and F. Furuta and B.M. Hanna and S. Kazakov and J.P. Ozelis and K.S. Premo and N. Solyak and G. Wu}, % author = {J. Helsper and S.K. Chandrasekaran and F. Furuta and B.M. Hanna and S. Kazakov and J.P. Ozelis and others}, % author = {J. Helsper and others}, title = {{Design, Manufacturing, Assembly, Testing, and Lessons Learned of the Prototype 650 MHz Couplers}}, booktitle = {Proc. LINAC'22}, % booktitle = {Proc. 31st International Linear Accelerator Conference (LINAC'22)}, pages = {462--465}, eid = {TUPOPA25}, language = {english}, keywords = {vacuum, SRF, cryomodule, cavity, multipactoring}, venue = {Liverpool, UK}, series = {International Linear Accelerator Conference}, number = {31}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {09}, year = {2022}, issn = {2226-0366}, isbn = {978-3-95450-215-8}, doi = {10.18429/JACoW-LINAC2022-TUPOPA25}, url = {https://jacow.org/linac2022/papers/tupopa25.pdf}, abstract = {{Six 650 MHz high-power couplers will be integrated into the prototype High Beta 650 MHz (HB650) cryomodule for the PIP-II project at Fermilab. The design of the coupler is described, including design optimizations from the previous generation. This paper then describes the coupler life-cycle, including manufacturing, assembly, testing, conditioning and the lessons learned at each stage.}}, }